- High Quality 3D TLC
- High Performance LDPC ECC mechanism to enhance error correction ability.
- Extended P/E cycle for better endurance
- Fully compatible with eMMC standard specification v5.1
- Supports HS400 speed mode, backward compatible to HS200
- Backward compatible to legacy MMC card mode
- Highly compatible to mainstream platforms
- Stable performance for fluent system operations
- Low power consumption
- Small package size to fit in dimension concerned platforms
| Appearance | |
| Dimension | 13mm x 11.5mm x 1mm |
| Package | FBGA 153 Ball |
| eMMC Standard | |
| Interface | eMMC 5.1 |
| Mode | HS400 |
| Performance | |
| Sequencial Read | up to 265MB/s |
| Sequencial Write | up to 145MB/s |
| Working Environment | |
| Operating Temperature | -25°C~85°C |
| Storage Temperature | -40°C~85°C |
| Humidity | 0%~95% |
| Power | |
| Operating Power Consumption | 720mW |
| Stand-by Power Consumption | 0.32mW |
| VCCQ (I/O) | 1.70V~1.95V and 2.7V~3.6V |
| VCC (NAND) | 2.7V~3.6V |
| *Note: Performance may vary due to host hardware, usage, and storage capacity. |
|---|
| 32GB | UEMBGS23T0 |
| 64GB | UEMCGS23T0 |
| 128GB | UEMDGS23T0 |
